View TB62209FG-14_8453670.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

tb62209f g 201 4 - 10- 0 1 1 toshiba bi cd processor ic silicon monolithic tb62209f g stepping motor driver ic using pwm c hopper type the tb6220 9 fg is a stepping motor driver driven by chopper micro - step pseudo sine wave. the tb 62209f g integrates a decoder for clk input in micro steps as a system to facilitate driving a two - phase stepping motor using micro - step pseudo sine waves. micro- step pseudo sine waves are optimal for driving stepping motors with low - torque ripples and at l ow oscillation. thus, the tb62 2 09f g can easily drive stepping motors with low - torque ripples and at high efficiency. also, tb62209fg consists of output steps by dmos (power mos fet), and that makes it possible to control the output power dissipation much l ower than ordinary ic with bipolar transistor output. the ic supports mixed decay mode for switching the attenuation ratio at chopping. the switching time for the attenuation ratio can be switched in four stages according to the load. features ? bipolar ste pping motor can be controlled by a single driver ic ? monolithic bi cd ic ? low on - resistance of r on = 0.5 (t j = 25c @1.0 a: typ.) ? built -in decoder and 4 - bit da converters for micro steps ? built - in isd, tsd, v dd & v m power monitor (reset) circuit for protectio n ? built - in charge pump circuit (two external capacitors) ? 36- pin power flat package (hsop36 -p-450- 0.65) ? output voltage : 40 v max ? output current : 1.8 a/phase max ? 2 - phase, 1 - 2 (type 2) phase, w1- 2 phase, 2w1- 2 phase, 4w1- 2 phase, or motor lock mode can be sel ected. ? built - in mixed decay mode enables specification of four - stage attenuation ratio. ? chopping frequency can be set by external resistors and capacitors. high - speed chopping possible at 100 khz or higher. note: when using the ic, pay attention to therma l conditions. th is device i s easily damaged by high static voltage, please handle with care. th is product is rohs compatible . weight: 0.79 g (typ.) ? 201 4 toshiba corporation
tb62209f g 201 4 - 10- 0 1 2 block diagram 1. overview reset cw/ccw enable standby d mode 3 d mode 2 d mode 1 clk r s v m ccp c ccp b ccp a mo v dd torque 1 torque 2 mdt 1 mdt 2 chopper osc current level set current feedback ( 2) protection unit tsd protect v ref standby enable v m v dd stepping motor micro - step decoder torque control 4 - bit d / a (sine angle control ) v rs 1 r s comp 1 v rs 2 r s comp 2 c harge pump unit output (h - bridge ) 2 ocs cr- clk converter output control (mixed decay control) tsd isd v ddr /v mr protect cr v m
tb62209f g 201 4 - 10- 0 1 3 2. logic unit function the microstep electrical angle is output according to the logic of the pin settings. d mode 1 d mode 2 d mode 3 cw/ccw clk standby mdt 1 mdt 2 decay 2 bit a unit torque 1 torque 2 data mode micro - step decoder micro - step current data 4 bit a unit side phase 1 bit a unit current feedback circuit mixed decay circuit output control circuit d/a circuit output control circuit enable reset t orque 2 bit decay 2 bit b unit side phase 1 bit b unit side micro - step current data 4 bit b unit side
tb62209f g 201 4 - 10- 0 1 4 3. current feedback circuit and current setting circuit function the current settin g circuit is used to set the reference voltage of the output current using the current setting decoder . the current feedback circuit is used to output to the output control circuit the relation between the set current value and output current. this is done by comparing the reference voltage output to the current setting circuit with the potential difference generated when current flows through the current sense resistor connected between r s and v m . the chopping waveform generator circuit to which cr is con nected is used to generate clock used as reference for the chopping frequency. note 1: r s comp1 : compares the set current with the output current and outputs a signal when the output current reaches the set current. note 2: r s comp2 : compares the set cu rrent with the output current at the end of fast mode during chopping. outputs a signal when the set current is below the output current. waveform shaping circuit v m r s v ref 100% 85% 70% 50% chopping waveform generator circuit cr v rs circuit 1 ( detects potential difference between r s and v m ) r s comp circuit 1 ( note 1) nf (set current reached signal ) v rs circuit 2 ( dete cts potential difference between v m and r s ) r s comp circuit 2 ( note 2) rnf ( set current monitor signal ) < use in fast mode > < use in charge mode > output control circuit m ixed d ecay timing circuit output stop signal (all off) chopping refer ence circuit 0 current feedback circuit torque control circuit current setting circuit d/a circuit torque 0, 1 current 0 - 3 decoder unit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 micro - step current setting selector circuit 4 - bit d/a circuit
tb62209f g 201 4 - 10- 0 1 5 4. output control circuit, current feedback circuit and current setting circuit output control circuit note : the standby pins are pulled down in the ic by 10 0 -k ? resistor. when not using the pin, connect it to gnd. otherwise, malfunction may occur. micro - step current setting decoder circuit chopping reference circuit isd circuit output pin v mr circuit v m v ddr circuit v dd tsd circuit current feedback circuit current setting circuit c harge pump circuit cop a cr counter cr selector v dd v m logic v ddr : v dd power on rese t v mr : v m power on rese t isd: curre nt shutdown circuit tsd: t hermal shutdown circuit protection circuit charge pump circuit micro - step current setup latch clear signal mixed decay timing table clear signal cop b cop c phase decay mode mixed decay timing circuit output reset signal output circuit output circuit charge pump halt signal power supply for upper drive output v h standby nf set current reached signal rnf set current monitor signal output stop signal output control circuit internal stop signal select circuit mixed decay timing charge start u1 u2 l1 l2
tb62209f g 201 4 - 10- 0 1 6 5. output equivalent circuit note : the diode on the dotted line is a body diode. v m b u1 l1 u2 l2 to v m from output control circuit output a output a r s a r rs a m u1 l1 u2 l2 pgnd from output control circuit outp ut b output b r rs b power supply for upper drive output ( v h ) u1 u2 l1 l2 output driver circuit phase b r sb v m a power supply for upper drive output ( v h ) u1 u2 l1 l2 output driver circuit phase a
tb62209f g 201 4 - 10- 0 1 7 6. inpu t equivalent circuit 1. input circuit (clk , torque , mdt , cw/ccw) 2. input circuit ( reset, enable , standby , d ata m o d e , d rive mod e ) 3. v ref input circuit 4. out put circuit (mo , protect) v dd v ss in 150 to logic ic gnd v dd v ss in 150 to logic ic gnd 100 k v dd v ss in to d/a circuit gnd 2 v dd v ss out gnd
tb62209f g 201 4 - 10- 0 1 8 pin assignment (top view) pin assignment for pwm in data mode d mode 1 ga + (out a , a ) d mode 2 ga ? (out a , a ) d mode 3 gb + (out b , b ) cw/ccw gb ? (out b , b ) note : pin assignment above is different at data mode and pwm. 1 d mode 1 2 d mode 2 36 35 cr clk 3 d mode 3 4 cw/c cw 5 v dd 6 v ref 7 nc 8 nc 9 r s b ( f in ) 10 r s a 11 nc 12 nc 13 vm 14 standby 15 ccp a 16 ccp b 17 ccp c 18 mo 34 enable 33 out b 32 reset 31 data mode 30 nc 29 out b 28 p gnd ( f in ) 27 pgnd 26 out a 25 nc 24 mdt 2 23 mdt 1 22 out a 21 torque2 20 torque1 19 protect tb62209f g 7pin and 8pin are connected by a lead frame. however, there is no connection to the chip. 11pin and 12pin are connected by a lead frame. however, there is no connection to the chip.
tb62209f g 201 4 - 10- 0 1 9 pin description 1 pin number pin name function remarks 1 d mode 1 motor drive mode setting pin d mode 3, 2, 1 = lll: same function as that of standby pin llh : motor lock mode lhl : 2 - phase excitation mo de lhh : 1 - 2 phase excitation (a) mode hll : 1 - 2 phase excitation (b) mode hlh : w1 - 2 phase excitat ion mode hhl : 2w1 - 2 phase excitation mode hhh: 4w1 - 2 phase excitation mode 2 d mode 2 3 d mode 3 4 cw/ccw sets motor rotation direction cw: forward rotation ccw: reverse rotation 5 v dd logic power supply connecting pin connect to logic power supply (5 v) 6 v ref reference power supply pin for setting output current connect to supply voltage for setting current. 7 nc not connected not wired 8 nc not connected not wired 9 r s b unit - b power supply pin (connecting pin for power detection resistor) co nnect current sensing resistor between this pin and v m f in f in fin logic ground pin connect to power ground the pin functions as a heat sink. design pattern taking heat into consideration. 10 r s a unit - a power supply pin (pin connecting power detection r esistor) connect current sensing resistor between this pin and v m 11 nc not connected not wired 12 nc not connected not wired pin assignment for pwm in data mode d mode 1 ga + (out a , a ) d mode 2 ga ? (out a , a ) d mode 3 gb + (out b , b ) cw/ccw gb ? (out b , b )
tb62209f g 201 4 - 10- 0 1 10 pin description 2 pin number pin name function remarks 13 v m motor power supply monitor pin connect to motor power supply 14 standby all - function - initializing and low power dissipation mode pin h: normal operation l: operation halted charge pump output halted 15 ccp a pin connecting capacitor for boosting output stage drive power supply (storage side connected to gnd) connect capacito r for charge pump (storage side) v m and v dd are generated. 16 ccp b pin connecting capacitor for boosting output stage drive power supply connect capacitor for charge pump (charging side) between this pin and ccp c 17 ccp c (charging side) connect capaci tor for charge pump (charging side ) between this pin and ccp b 18 mo electrical angle (0 ) monitor pin outputs high level in 4w1 - 2, 2w1 - 2, w1 - 2, or 1 - 2 phase excitation mode with electrical angle of 0 (phase b: 100%, phase a: 0%) in 2 - phase excitation mo de, outputs high level with electrical angle of 0 (phase b: 100%, phase a: 100%) 19 protect tsd operation detector pin detects thermal shut down (tsd) and outputs high level 20 torque 1 motor torque switch setting pin torque 2, 1 = hh: 100% lh: 85% hl : 70% ll: 50% 21 torque 2 22 out a channel a output pin D 23 mdt 1 mixed decay mode setting pins mdt 2, 1 = hh: 100% hl: 75% lh: 37.5% ll: 12.5% 24 mdt 2
tb62209f g 201 4 - 10- 0 1 11 pin description 3 pin number pin name fu nction remarks 25 nc not connected not wired 26 out a channel a output pin D 27 pgnd power ground pin connect all power ground pins and v ss to gnd. f in f in logic ground pin the pin functions as a heat sink. design pattern taking heat into consideration . 28 pgnd power ground pin connect all power ground pins to gnd. 29 out b channel b output pin D 30 nc not connected not wired 31 data mode clock input and pwm h: controls external pwm. l: clk - in mode we recommend this pin normally be used as clk - in mo de pin (low). in pwm mode, functions such as constant current control do not operate. fix data mode at the l level . 32 reset initializes electrical angle. forcibly initializes electrical angle. at this time we recommend enable pin be set to low to preven t mis s operation. h: resets electrical angle. l: n ormal operation 33 out b channel b output pin D 34 enable output enable pin forcibly turns all output transistors off. 35 clk inputs clk for determining number of motor rotations. electrical angle is incremented by one for each clk input. clk is reflected at rising edge. 36 cr chopping reference fr equency reference pin (for setting chopping frequency) determines chopping frequency.
tb62209f g 201 4 - 10- 0 1 12 1. function of cw/ccw cw/ccw switches the direction of stepping motor rotation. input function h forward (cw) l reverse (ccw) 2. function of mdt x mdt x specifies the c urrent attenuation speed at constant current control. the larger the rate (%), the larger the attenuation of the current. also, the peak current value (current ripple) becomes larger. (typical value is 37.5%.) mdt 2 mdt 1 function l l 12.5% mixed decay m ode l h 37.5% mixed decay mode h l 75% mixed decay mode h h 100% mixed decay mode (fast decay mode) 3. function of torque x torque x changes the current peak value in four steps. used to change the value of the current used, for example, at startup and fixed - speed rotation. torque 2 torque 1 comparator reference voltage h h 100% l h 85% h l 70% l l 50% 4. function of reset (forced initialization of electrical angle) with the clk input method (decoder method), unless clks are counted, except mo, wher e the electrical angle is at that time not known. thus, this method is used to forcibly initialize the electrical angle. for example, it is used to change the excitation mode to another drive mode during output from mo (electrical angle = 0 ). input funct ion h initializes electrical angle to 0 l normal operation
tb62209f g 201 4 - 10- 0 1 13 5. function of enable (output operation) enable forcibly turns off all output transistors at operation. data such as electrical angle and operating mode are all retained. input function h opera tion enabled (active) l output halted (operation other than output active) 6. function of standby standby halts the charge pump circuit (power supply booster circuit) as well as halts output. we recommend setting to standby mode at power on. (at this time, data on the electrical angle are retained.) input function h operation enabled (active) l output halted (low power dissipation mode)charge pump halted 7. functions of d mode x ( excitation mode ) 8. function of data mode data mode switches external duty control (forced pwm control) and constant current clk - in control. in phase mode, h - bridge can be forcibly inverted and output only can be turned off. constant current driv e including micro - step drive can only be controlled in clk - in mode. input function h phase mode l clk - in mode note : normally, use clk - in mode. excitation mode d mode 3 d mode 2 d m ode 1 remarks 1 low power dissipation mode l l l ( standby mode ) charge pump halted 2 motor lock mode l l h locks only at 0 electrical angle. 3 2 - phase excitation mode l h l 45 135 225 315 45 4 1 - 2 phase excitation (a) l h h 0%, 100% type 1 - 2 phase excitation 5 1 - 2 phase excitation (b) h l l 0%, 71%, 100% type 1 - 2 phase excitation 6 w1 - 2 phase excitation h l h 2 - bit micro - step change 7 2w1 - 2 phase excitation h h l 3 - bit micro - step change 8 4w1 - 2 phase excitation h h h 4 - bit micro - step change
tb62209f g 201 4 - 10- 0 1 14 9. electrical angle setting immediately after initialization in initialize mode (immediately a fter reset is r eleased), the following currents are set. in low power dissipation mode, the internal decoder continues incrementing the electrical angle but current is not output. note that the initial electrical angle value in 2 - phase excitation mode differs from that i n nw1 - 2 (n = 0, 1, 2, 4) phase excitation mode. excitation mode ib (%) ia (%) remarks 1 low power dissipation mode 100 0 electrical angle incremented but no current output 2 motor lock mode 100 0 electrical angle incremented but no motor rotation due t o no ia output 3 2 - phase excitation 100 100 45 4 1 - 2 phase excitation (a) 100 0 0 5 1 - 2 phase excitation (b) 100 0 0 6 w1 - 2 phase excitation 100 0 0 7 2w1 - 2 phase excitation 100 0 0 8 4w1 - 2 phase excitation 100 0 0 note : where, ib = 10 0% and ia = 0%, the electrical angle is 0 . where, ib = 0% and ia = 100%, the electrical angle is + 90. 10. function of data mode (phase a mode used for explanation ) data mode inputs the external pwm signal (duty signal) and controls the current. functions su ch as constant current control and overcurrent protector do not operate. use this mode only when control cannot be performed in clk - in mode. ga + ga ? output state (1) l l output off (2) l h a + phase: low a ? phase: high (3) h l a + phase: high a ? phase: low (4) h h output off note: output is off at (1) and (4). d mode 1 ga + (out a , a ) d mode 2 ga ? (out a , a ) d mode 3 gb + (out b , b ) cw/ccw gb ? (out b , b ) u1 l1 u2 l2 off off pgnd off off (1) ? (4) u1 l1 u2 l2 off off on on ( note ) load pgnd ( 2) u1 l1 u2 l2 off off on on ( note ) load pgnd (3)
tb62209f g 201 4 - 10- 0 1 15 absolute maximum ratings (ta = 25 c) characteristics symbol rating unit logic supply voltage v dd 7 v motor supply voltage v m 40 v output current (note 1) i out 1.8 a/phase current detect pin voltage v rs v m 4.5 v v charge pump pin maximum voltage (ccp1 pin) v h v m + 7.0 v logic input voltage (note 2) v in - 0.4 to v dd + 0.4 v power dissipation (note 3) p d 1.4 w (note 4) 3.2 operating tempera ture t opr ? 40 to 85 c storage temperature t stg ? 55 to 150 c junction temperature t j 150 c note 1: perform thermal calculations for the maximum current value under normal conditions. use the ic at 1. 5 a or less per phase. the current v a lue may be control l ed acc ording to the ambient temperature or board conditions. note 2: input 7 v or less as v in . note 3: measured for the ic only. (ta = 25 c) note 4: measured when mounted on the board. (ta = 25 c) t a: ic ambient temperature t opr : ic ambient temperature when star ting operation t j : ic chip temperature during operation . t j (max) is controlled by tsd (thermal shut down circuit) . operating conditions (ta = 0 to 85 c, (note 5)) characteristics symbol test condition min typ. max unit power supply voltage v dd D 4.5 5.0 5.5 v motor supply voltage v m v dd = 5.0 v, ccp1 = 0.22 f, cc p2 = 0.022 f 13 24 34 v output current i out (1) ta = 25 c, per phase D 1.2 1.5 a logic input voltage v in D gnd D v dd v clock frequency f clk v dd = 5.0 v D 1 . 0 150 khz chopping freq uency f chop v dd = 5.0 v 50 100 150 khz reference voltage v ref v m = 24 v, torque = 100% 2.0 3.0 v dd v current detect pin voltage v rs v dd = 5.0 v 0 1.0 4.5 v note 5: because the maximum value of t j is 120 c, please design the maximum current to the valu e from which tj becomes under 120 c .
tb62209f g 201 4 - 10- 0 1 16 electrical characteristics 1 (ta = 25 c, v dd = 5 v, v m = 24 v , unless otherwise specified ) characteristics symbol test circuit test condition min typ. max unit input voltage high v in (h) D data input pins 2.0 v dd v dd 0.4 v low v in (l) gnd ? 0.4 gnd 0.8 input hysteresis voltage v in (his) D data input pins 200 400 700 mv input current i in (h) D data input pins with resistor 35 50 75 a i in (h) data input pins without resistor D D 1.0 i in (l) D D 1.0 power dissipation (v dd pin ) i dd1 D v dd = 5 v (strobe, reset , data = l), reset = l, logic, output all off 1.0 2.0 3.0 ma i dd2 output open, f clk = 1.0 khz logic active, v dd = 5 v, charge pump = charged 1.0 2.5 3.5 power diss ipation (v m pin ) i m1 D output open (strobe, reset , data = l), reset = l, logic, output all off , charge pump = no operation 1.0 2.0 3.0 ma i m2 output open, f clk = 1 khz logic active, v dd = 5 v, v m = 24 v, output off , charge pump = charged 2.0 4.0 5.0 i m3 output open, f clk = 4 khz logic active, 100 khz chopping (emulation), output open, charge pump = charged D 10 13 output standby current upper i oh D v rs = v m = 24 v , v out = 0 v, standby = h, reset = l, clk = l ? 200 ? 150 D a outp ut bias current upper i ob D v out = 0 v , standby = h, reset = l, clk = l ? 100 ? 50 D a output leakage current lower i ol D v rs = v m = ccpa = v out = 24 v, logic in = all = l D D 1.0 a comparator reference voltage ratio high (reference) v r s (h) D v ref = 3.0 v , v ref (gain) = 1/5.0 torque = (h) = 100% set D 100 D % mid high v rs (mh) v ref = 3.0 v , v ref (gain) = 1/5.0 torque = (mh) = 85% set 83 85 87 mid low v rs (ml) v ref = 3.0 v , v ref (gain) = 1/5.0 torque = (ml) = 70% set 68 70 72 l ow v rs (l) v ref = 3.0 v , v ref (gain) = 1/5.0 torque = (l) = 50% set 48 50 52 output current differential ?i out1 D differences between output current channels ? 5 D 5 % output current setting differential ?i out2 D i out = 1000 ma ? 5 D 5 % rs pin current i rs D v rs = 24 v , v m = 24 v, reset = l (reset state) D 1 2 a output transistor drain - source on - resistance r on (d - s) 1 D i out = 1.0 a , v dd = 5.0 v t j = 25 c , drain - source D 0.5 0.6 r on ( d - s ) 1 i out = 1.0 a , v dd = 5.0 v t j = 25 c , source - drain D 0.5 0.6 r on (d - s) 2 i out = 1.0 a , v dd = 5.0 v t j = 105 c , drain - source D 0.6 0.75 r on ( d - s ) 2 i out = 1.0 a , v dd = 5.0 v t j = 105 c , source - drain D 0.6 0.75
tb62209f g 201 4 - 10- 0 1 17 electrical characteristics 2 (ta = 25 c, v dd = 5 v, v m = 24 v, i out = 1.0 a) characterist ics symbol test circuit test condition min typ. max unit chopper current vector D a = 90 ( 16) D D 100 D % a = 84 ( 15) D 100 D a = 79 ( 14) 93 98 D a = 73 ( 13) 91 96 D a = 68 ( 12) 87 92 97 a = 62 ( 11) 83 88 93 a = 56 ( 10) 78 83 88 a = 51 ( 9) 72 77 82 a = 45 ( 8) 66 71 76 a = 40 ( 7) 58 63 68 a = 34 ( 6) 51 56 61 a = 28 ( 5) 42 47 52 a = 23 ( 4) 33 38 43 a = 17 ( 3) 24 29 34 a = 11 ( 2) 15 20 25 a = 6 ( 1) 5 10 15 a = 0 ( 0) D 0 D
tb62209f g 201 4 - 10- 0 1 18 electrical characteristics 3 ( ta = 25 c, v dd = 5 v, v m = 24 v , unless otherwise specified ) characteristics symbol test circuit test condition min typ. max unit v ref input voltage v ref 9 v m = 24 v , v dd = 5 v , standby = h, reset = l , output on , clk = 1 khz 2.0 D v dd v v ref input current i ref 9 standby = h , reset = l , output on , v m = 24 v , v dd = 5 v , v ref = 3.0 v 20 35 50 a v ref attenuation ratio v ref (gain) v m = 24 v , v dd = 5 v, standby = h , re set = l , output on, v ref = 2.0 to v dd ? 1.0 v 1/4.8 1/5.0 1/5.2 D tsd temperature (note 1) t j tsd v dd = 5 v , v m = 24 v 130 D 170 c tsd return temperature difference (note 1) ?t j tsd t j tsd = 130 to 170 c t j tsd ? 50 t j tsd ? 35 t j tsd ? 20 c v dd return voltage v ddr 10 v m = 24 v , standby = h 2.0 3.0 4.0 v v m return voltage v mr 11 v dd = 5 v , standby = h 2.0 3.5 5.0 v over current protected circuit operation current (note 2) isd v dd = 5 v , v m = 24 v D 3.0 D a high temp erature monitor pin output current i protect 12 v dd = 5 v , tsd = operating condition 1.0 3.0 5.0 ma electrical angle monitor pin output current i mo 12 v dd = 5 v , electrical angle = 0 (ib = 100% , ia = 0%) 1.0 3.0 5.0 ma high temperature monitor pin outp ut voltage v protect (h) 12 v dd = 5 v , tsd = operating condition D D 5.0 v v protect (l) v dd = 5 v , tsd = not operating condition 0.0 D D electrical angle monitor pin output voltage v mo2 (h) 12 v dd = 5 v , electrical angle = except 0 (ib = 100% , ia = except 0% set) D D 5.0 v v mo2 (l) v dd = 5 v , electrical an gle = 0 (ib = 100% , ia = 0%) 0.0 D D note 1: thermal shut down circuit (tsd) when the ic junction temperature reaches the specified value and the tsd circuit is activated, the internal reset circuit is activated switching the outputs of both motors to off. when the temperature is set between 130 c (min) to 170c (max), the tsd circuit operates. when the tsd is activated, the output of motors is stopped until the stand - by function is reset. when the tsd circuit is activated, the charge pump is h alted, an d p rotect pin outputs v dd voltage. even if the tsd circuit is activated and standby goes h l h instantaneously, the ic is not reset until the ic junction temperature drops ? 20 c (typ.) below the tsd operating temperature (hysteresis function). note 2: overcurrent protection circuit (isd) when current exceeding the specified value flows to th e output, the internal reset circuit is activated, and the isd turns off the output. until the standby signal goes low to high , the overcurrent protection circuit remains activated. during isd, ic turns standby mode and the charge pump halts.
tb62209f g 201 4 - 10- 0 1 19 ac characteristics (ta = 25 c, v m = 2 4 v, v dd = 5 v, 6.8 mh/5.7 ) characteristics symbol test circuit test condition min typ. max unit clock frequency f clk D D D 120 khz minimum clock pulse width t w ( t clk ) D 100 D D ns t wp D 50 D D t wn D 50 D D output transistor switching characteristic t r output lo ad : 6.8 mh/5.7 D 100 D ns t f D D 100 D t plh c lk to out D 1000 D t phl output load : 6.8 mh/5.7 D 2000 D t plh c r to out D 500 D t phl output load : 6.8 mh/5.7 D 1000 D transistor switching characteristics (mo, protect) t r D D 2 0 D ns t f D D 20 D t plh D D 20 D t phl D D 20 D noise rejection dead band time t brank i out = 1.0 a 200 300 400 ns cr reference signal oscillation frequency f cr c osc = 560 pf, r osc = 3.6 k D 800 D khz chopping frequency range f chop (mi n) f chop (max) v m = 24 v, v dd = 5 v, output active (i out = 1.0 a) step fixed, ccp1 = 0.22 f, ccp2 = 0.0 22 f 40 100 150 khz chopping frequency f chop output active (i out = 1.0 a), cr clk = 800 khz D 100 D khz charge pump rise time t ong ccp = 0.22 f, ccp = 0.0 22 f v m = 24 v, v dd = 5 v, standby = on l h D 100 200 s
tb62209f g 201 4 - 10- 0 1 20 1 1 . current waveform and setting of mixed decay mode at constant current control, in current amplitude (pulsating current) decay mode, a poi nt from 0 to 3 can be set using 2 - bit parallel data. nf is the point where the output current reaches the set current value. rnf is the timing for monitoring the set current. the smaller the mdt value, the smaller the current ripple (peak current value). n ote that current decay capability deteriorates. nf f chop 12.5% mixed decay mode cr pin internal clk waveform charge mode nf: set current value reached slow mode mixed decay timing fast mode current monitored (when set current v alue > output current) charge nf rnf set current value rnf mdt decay mode 0 37.5% mixed decay mode charge mode nf: set current value reached slow mode mixed decay timing fast mode current monitored (when set current value > output cu rrent) charge rnf set current value decay mode 1 75% mixed decay mode charge mode nf: set current value reached slow mode mixed decay timing fast mode current monitored (when set current value > output current) charge mode rnf set cur rent value mdt nf decay mode 2 fast decay mode fast mode rnf: current monitored (when set current value > output current) charge mode fast mode rnf set current value decay mode 3 100% 75% 50% 25% 0 mdt
tb62209f g 201 4 - 10- 0 1 21 1 2. current modes (mixed ( slow + fast) decay mode effect ) current value in increasing (sine wave ) sine wave in decreasing (when using mixed decay mode with large attenuation ratio (mdt%) at attenuation) sine wave in decreasing (when using mixed decay mode with small attenuation ratio (mdt%) at attenuation) if rnf, current watching point, was the set current value (output current) in the mixed decay mode and in the fast decay mode, there is no charge mode but the slow + fast mode (slow to fast is at mdt) in t he next chopping cycle. note: the above charts are schematics. the actual current transient responses are curves. slow slow slow slow f ast f ast charge charge f ast charge fast charge set current value set current value set current value set current value slow slow f ast charge f ast charge slow f ast slow f ast charge because current attenuates so quickly, the current immediately follows the set current value. set current value set current value slow f ast charge slow f ast charge f ast slow f ast slow because current attenuates slowly, it takes a long time for the current to follow the set current value (or the current do es not follow).
tb62209f g 201 4 - 10- 0 1 22 1 3. mixed decay mode waveform ( current waveform ) ? when nf is after mixed decay timing ? in mixed decay mode, when the output current > the set current value nf nf 25 % mixed decay mode i nternal cr clk signal i out f chop f chop set current value set current value rnf mdt (mixed decay timing) point nf nf 25 % mixed decay mode i out f chop f chop set current value set current value nf mdt (mixed decay timing) point clk signal input fast decay mode after charge mode rnf nf nf 25 % mixed decay mode i out f chop f chop set current value clk signal input f chop mdt (mixed decay timing) point set current value rnf rnf because o f the set current value > the output curren t, no charge mode in the next cycle .
tb62209f g 201 4 - 10- 0 1 23 1 4. fast decay mode waveform the output current to the motor is in supply voltage mode after the current value set by v ref , r rs , or to rque reached at the set current value. f chop clk signal input fast decay mode (100% mixed decay mode) set current value i out nf because of th e set current value > the output current , charge mode nf fast decay mode in the next cycle. because of the set current value > the output curren t, fast decay mode in the next cycle. (charge cancel function) rnf rnf rnf set current value
tb62209f g 201 4 - 10- 0 1 24 15. clk signal, internal cr clk, and output current wave form (when clk signal is input in slow d e c ay mode) when clk signal is input, the chopping counter (cr - clk counter) is forced to reset at the next cr - clk timing. because of this, compared with a method in which the counter is not reset, response to the input data is faster. the delay time, the theoretical value in the logic portion, is expected to be a one - cycle cr waveform: 5 s at 100 khz chopping. when the cr counter is reset due to clk signal input, charge mode is entered momentarily due to current c omparison. note: in fast decay mode, too, charge mode is entered momentarily due to current comparison. clk signal input set current value ii out i out rnf set curr ent value f chop i nternal cr clk signal momentarily enters charge mode reset cr - clk counter here nf rnf mdt nf mdt f chop f chop
tb62209f g 201 4 - 10- 0 1 25 16. clk signal, internal cr clk, and output current waveform (when clk signal is input in charge mode) 12.5 % mixed decay mode clk signal input set current value i out rnf set current value f chop internal cr clk sign al momentarily enters charge mode reset cr - clk counter here nf rnf mdt mdt f chop f chop
tb62209f g 201 4 - 10- 0 1 26 12.5 % mixed decay mode 17. clk signal, internal cr clk, and out put current waveform (when clk signa l is input in fast d e c ay mode) nf clk signal input set current value i out rnf set current value f chop internal cr clk signal momentarily enters charge mode reset cr - clk counter here f chop f chop mdt nf rnf mdt mdt
tb62209f g 201 4 - 10- 0 1 27 18. clk signal, internal cr clk, and output current waveform (when clk signal is input in 2 excitation mode ) 12.5 % mixed decay mode clk signal input f chop reset cr - clk counter here f chop f chop set current value i out rnf set current value nf rnf 0 mdt nf
tb62209f g 201 4 - 10- 0 1 28 current discharge path when enabl e=l i nput during operation in slow mode , when all output transistors are forced to switch off, coil energy is discharged in the following modes: note : parasitic diodes are located on dotted lines. in normal mixed decay mode, the current does not flow to the parasitic diodes. as shown in the figure at above, an output transistor has parasitic diodes. to discharge energy from the coil, each transistor is switched on allowing current to flow in the reverse direction to that of normal operation. as a result, the parasitic diodes are not used. if all the output transistors are forced to switch off, the energy of the coil is discharged via the parasitic diodes. u1 l1 u2 l2 pgnd off off u1 l1 u2 l2 off on (note) load pgnd u1 l1 u2 l2 off off (note) load pgnd (note) r s pin r rs v m on on load charge mode slow mode forced off mode on r s pin r rs v m r s pin r rs v m off off input enabl e=l off
tb62209f g 201 4 - 10- 0 1 29 output transistor operating mode output transistor operation functions clk u1 u2 l1 l2 charge on off off on slow off off on on fast off on on off note : the above table is an example where current flows in the direction of the arrows in the above figures. when the current flows in the opposite direction of the arrows, see the table below. clk u1 u2 l1 l2 charge off on on off slow off off on on fast on off off on u1 l1 u2 l2 pgnd off off u1 l1 u2 l2 off on on (note) load pgnd u1 l1 u2 l2 (note) load pgnd (note) r s pin r rs v m on on load charge mode slow mode fast mode on r s pin r rs v m r s pin r rs v m off off on off
tb62209f g 201 4 - 10- 0 1 30 power supply sequence (recommended) note 1 : if the v dd drops to the level of the v ddr or below while the specified voltage is input to the v m pin, the ic is internally reset. this is a protective measure against malf unction. likewise, if the v m drops to the level of the v mr or below while regulation voltage is input to the v dd , the ic is internally reset as a protective measure against malfunction. to avoid malfunction, when turning on v m or v dd , to input the standby signal at the above timing is recommended. it takes time for the output control charge pump circuit to stabilize. wait up to t ong time after power on before driving the motors. note 2: when the v m value is between 3.3 to 5.5 v, the inter nal reset is released, thus output may be on. in such a case, the charge pump cannot drive stably because of insufficient voltage. the standby state should be maintained until v m reaches 13 v or more. note 3: since v dd = 0 v and v m = volt age within the rating are applied, output is turned off by internal reset. at that time, a current of several ma flows due to the pass between v m and v dd . when voltage increases on v dd output, make sure that specified voltage is input. v dd ( max ) v dd ( min ) v ddr gnd v dd v m v m ( min ) v mr gnd v m non - reset reset internal reset h l standby i nput (note 1) takes up to t ong until operable. non - operable area standby
tb62209f g 201 4 - 10- 0 1 31 how to calculate set current this ic controls constant current in clk - in mode. at that time, the maximum current value (set current value) can be determined by setting the sensing resistor (r rs ) and reference voltage (v ref ). 1/5.0 is v ref (gain): v ref attenuation ratio . (for the specifications, see the electrical characteristics.) for example, when inputting v ref = 3 v and torque = 100% to output i out = 0.8 a , r rs = 0.75 (0.5 w or more) is required. how to calculate the chopping and osc frequencies at constant curre nt control, this ic chops frequency using the oscillation waveform (saw tooth waveform) determined by external capacitor and resistor as a reference. the tb62209f g requires an oscillation frequency of eight times the chopping frequency. the oscillation fre quency is calculated as follows: c) 600 r (c 0.523 1 f cr + = for example, when c osc = 560 pf and r osc = 3.6 k are connected, f cr = 813 khz . at this time, the chopping frequency f chop is calculated as follows: f chop = f cr /8 = 101 khz when determining the chopping frequency, make the setting taking the above into consideration. ic power dissipation ic power dissi pation is classified into two: power consumed by transistors in the output block and power consumed by the logic block and the charge pump circuit. ? power consumed by the power transistor (calculated with r on = 0.60 ? ) in charge mode, fast decay mode, or sl ow decay mode, power is consumed by the upper and lower transistors of the h bridges. the following expression expresses the power consumed by the transistors of an h bridge. p (out) = 2 (t r ) i out (a) v ds (v) = 2 i out 2 r on .............................. (1) the average power dis sipation for output under 4 - bit micro step operation (phase difference between phases a and b is 90) is determined by expression (1). thus, power dissipation for output per unit is determined as follows (2) under the conditions below. r on = 0.60 ? (@ 1.0 a) i out (peak: max) = 1.0 a v m = 24 v v dd = 5 v p (out) = 2 (t r ) 1.0 2 (a) 0.60 ( ? ) = 1.20 (w) .............................................. (2) power consumed by the logic block and im the following standard values are used as power dissipation of the logic block and im at operation. i (logic) = 2 .5 ma (typ.): i (i m3 ) = 1 0 .0 ma (typ.): operation/unit i (i m1 ) = 2 .0 ma (typ.): stop/unit the logic block is connected to v dd (5 v). im (total of current consumed by the circuits connected to v m and current consumed by output switching) is connected to v m (24 v). power dissipation is calculated as follows: p (logic&im) = 5 (v) 0.00 25 (a) + 24 (v) 0.01 0 (a) = 0. 25 (w) ................ (3) thus, the total power dissipation (p) is p = p (out) + p (logic&im) = 1. 45 (w) power dissipation at standby is determined as follows : p (standby) + p (out) = 24 (v) 0.00 2 (a) + 5 (v) 0.00 25 (a) = 0. 06 (w) for thermal design on the board, evaluate by mounting the ic.
tb62209f g 201 4 - 10- 0 1 32 test waveforms ck t ck t ck t plh t phl v m gnd t r t f 10% 50% 90% 90% 50% 10% figure 1 timing waveforms and names
tb62209f g 201 4 - 10- 0 1 33 osc - charge delay: because the rising edge level of the osc waveform is used for converting the osc waveform to the internal cr clk, a delay of up to 1.25 ns (@f chop = 100 khz: f cr = 400 khz) occurs between the osc waveform and the internal cr clk. t chop osc - charge delay h l set current osc - fast delay osc (cr) 50% 50% l h h l l charge 50% slow fast output voltage a output voltage a outpu t current cr waveform internal cr clk waveform cr - cr clk delay figure 2 timing waveforms and names (cr and output)
tb62209f g 201 4 - 10- 0 1 34 relationship between drive mode input timing and mo ? if drive mode input changes before mo timin g parallel set signal is reflected. ? if drive mode input changes after mo timing parallel set signal occurs after the rising edge of clk, therefore, it is not reflected. the drive mode is changed when the electrical angle becomes 0 . note : the tb62209f g uses the drive mode change reserve method to prevent the motor from step out when changing drive modes. note that the following rules apply when switching drive modes at or near the mo signal output timing. clk waveform mo waveform drive mode input internal reflection (1) drive mode input wav eform (1) the setting of the motor drive mode changes. the motor drive mode changes. drive mode input internal reflection (2) drive mode input waveform (2) the setting of the motor drive mode changes. in this case, the drive mode is changed when the electrical angle becomes 0 .
tb62209f g 201 4 - 10- 0 1 35 reflecting points of sign als point where drive mode setting reflected ( area of 1 in figure ) cw/ccw 2 - phase excitation mode 45 (mo) before half - clock of phase b = phase a = 100% at rising edge of clk input 1 - 2 phase excitation mode w1 - 2 phase excitation mode 2w1 - 2 phase excitat ion mode 4w1 - 2 phase excitation mode 0 (mo) before half - clock of phase b = 100% at rising edge of clk input other parallel set signals can be changed at any time (they are reflected immediately). recommended point for switching drive mode mo waveform cl k waveform when drive mode data switching can be input during mo output (phase data halted : the area of 3 above ) to forcibly switch drive modes, a function to set reset = high and to initialize the electrical angle is required. 1 2 3 in the area 2, t he drive of the motor doesn't change even if the input signal of driving mode data switch t driving mode input in the area of 1 in figure is reflected.
tb62209f g 201 4 - 10- 0 1 36 p d C ta (p ackage power dissipation) (1) hsop36 r th (j - a) (96 c/w) (2) when mounted on the board (140 mm 70 mm 1.6 mm: 38 c/w: typ.) note: r th (j - a) : 8.5 c/w ambient temperature ta ( c) p d C ta power dissipation p d (w) (2) (1) 0 0 3.5 25 50 75 100 125 150 0.5 1 1.5 2 2.5 3
tb62209f g 201 4 - 10- 0 1 37 relationship between v m and v h ( charge pump voltage ) note : v dd = 5 v ccp 1 = 0.22 f , ccp 2 = 0.022 f , f chop = 150 khz ( be aware the temperature chan ges of capac itance of charge pump capacitor. ) v h voltage charge up voltage v m voltage v h voltage, charge up voltage (v) supply voltage v m (v) charge pump voltage v h = v dd + v m ( = ccp a) (v) 10 20 0 0 2 3 10 20 30 40 4 5 6 7 8 9 11 12 13 14 15 16 17 18 21 22 23 24 25 26 19 27 28 29 31 32 33 34 35 36 37 38 39 1 usable area v m C v h ( & vcharge up) maximum rati ng charge pump voltage v m voltage operation area input standby v mr maximum rating
tb62209f g 201 4 - 10- 0 1 38 operation of charge pump circuit ? initial charging (1) when reset is released, t r1 is turned on and t r2 turned off. ccp 2 is charged from v m via di1 . (2) t r1 is turned off, t r2 is turned on, and ccp 1 is charged from ccp 2 via di2. (3) when the voltage difference between v m and v h (ccp a pin voltage = charge pump voltage) reaches v dd or higher, operation halts (steady sta te ). ? actual operation (4) ccp 1 charge (i2) is used at f chop switching and the v h potential drops. (5) charges up by (1) and (2) above. v h = v m + v dd = char ge pump voltage i1 = charge pump current i2 = gate block power dissipation v dd = 5 v v m = 24 v comparator & controller v m output output h switch i2 ccp 1 0.22 f ccp a ccp b ccp c r 1 v h r s r rs ccp 2 0.0 22 f di2 di1 di3 v z i1 (2) t r1 t r2 (1) (2) output switching initial charging steady state (1) (2) (3) (4) t (5) (4) (5) v h v m
tb62209f g 201 4 - 10- 0 1 39 charge pump rise time t ong : time taken for capacitor ccp 2 (charging capacitor) to fill up ccp 1 ( storing capacitor) to v m + v dd after a reset is released. the internal ic cannot drive the gates correctly until the voltage of ccp 1 reaches v m + v dd . be sure to wait for t ong or longer before driving the motors. basically, the larger the ccp 1 capacitance, the smaller the volta ge fluctuation , though the initial charge up time is longer . the smaller the ccp 1 capacitance, the shorter the initial charge - up time but the voltage fluctuation is larger . depending on the combination of capacitors (especially with small capacitance), vo ltage may not be sufficiently boosted. when the voltage does not increase sufficiently, output dmos r on turns lower than the normal, and it raises the temperature. thus, use the capacitors under the capacitor combination conditions (ccp 1 = 0.22 f , ccp 2 = 0.0 22 f) recommended by toshiba. 50% v dd + v m v m + (v dd 90%) ccp 1 voltage v m 5 v 0 v standby t ong
tb62209f g 201 4 - 10- 0 1 40 external capacitor for charge pump when driving the stepping motor with v dd = 5 v, f chop = 150 khz, l = 10 mh under the conditions of v m = 13 v and 1.5 a, the logical values for ccp 1 and ccp 2 are as shown in the g raph below: choose ccp 1 and ccp 2 to be combined from the above applicable range. we recommend ccp 1:ccp 2 at 10:1 or more. (if our recommended values (c cp 1 = 0.22 f, c c p 2 = 0.02 2 f) are used, the drive conditions in the specification sheet are sati sfied. (there is no capacitor temperature characteristic as a condition.) when setting the constants, make sure that the charge pump voltage is not below the specified value and set the constants with a margin (the larger ccp 1 and ccp 2, the more the marg in). some capacitors exhibit a large change in capacitance according to the temperature. make sure the above capacitance is obtained under the usage environment temperature. ccp 1 capacitance ( f) ccp 1 C ccp 2 0.05 0 0 recommended value 0.005 0.01 0.015 0.02 0.025 0.03 0.035 0.04 0.045 0.05 0.1 0.15 0.2 0.25 0.35 0.4 0.45 0.5 0.3 applicable range
tb62209f g 201 4 - 10- 0 1 41 (1) low power dissipation mode low power dissipation mode turns off phases a and b, a nd also halts the charge pump. operation is the same as that when the standby pin is set to low. (2) motor lock mode motor lock mode turns phase b output only off with phase a off. from reset, with ia = 0 and ib = 100%, the normal 4w1 - 2 phase operating current is output. use this mode when you want to hold (lock) the rotor at any desired value. (3) 2 - phase excitation mode electrical angle 360 = 4 clk s note : 2 - phase excitation has a large load change due to motor induced electromotive force . if a mode in which the current attenuation capability (current control capability) is small is used, current increase due to induced electromotive force may not be suppressed. in such a case, use a mode in which the mixed decay ratio is large. we recomme nd 37.5% mixed decay mode as the initial value (general condition). 100 0 phase b phase a [%] ? 100 step 0 100 2 - phase excitation mode (typ. a)
tb62209f g 201 4 - 10- 0 1 42 (4) 1 -2 phase excitation mode (a) electrical angle 360 = 8 clk phase b phase a 100 0 [%] ? 100 step mo clk 1 - 2 phase excitation mode (typ. a) 0 100 100
tb62209f g 201 4 - 10- 0 1 43 (5) 1 - 2 phase excitation mode (b) electrical angle 360 = 8 clk mo phase b phase a 100 0 [%] ? 100 step 71 ? 71 clk 1 - 2 phase excitation mode (typ. b) 0 100 100 71 71
tb62209f g 201 4 - 10- 0 1 44 (6) w1 - 2 phase excitation mode electrical angl e 360 = 16 clk 100 0 [%] ? 100 step ? 92 ? 71 ? 38 38 92 71 phase a phase b w1 - 2 phase excitation mode (2 - bit micro step ) 0 100 100 71 71 38 92 38 92
tb62209f g 201 4 - 10- 0 1 45 (7) 2 w1 - 2 phase excitation mode electrical angle 360 = 32 clk 92 100 0 100 98 71 71 38 38 92 98 83 56 20 83 56 20 100 0 [%] ? 100 step ? 83 ? 3 8 ? 20 38 88 71 ? 92 ? 98 ? 71 ? 56 20 56 96 phase a phase b 2 w 1 - 2 phase excitation mode ( 3 - bit micro step)
tb62209f g 201 4 - 10- 0 1 46 (8) 4 w1 - 2 phase excitation mode el ectrical angle 360 = 64 clk ? 100 ste 0 ? 96 ? 88 ? 92 ? 77 ? 71 ? 56 ? 63 ? 47 ? 38 ? 29 ? 20 ? 10 ? 83 10 20 29 38 47 56 63 71 77 83 88 92 96 100 phase a phase b [%]
tb62209f g 201 4 - 10- 0 1 47 4 - bit micro step output current vector locus ( normalizing each step to 90 ) for input data, see the current function examples. x = 16 0 100 10 20 29 38 47 56 63 71 77 83 88 92 96 98 100 10 20 29 38 47 56 63 77 71 88 83 98 96 92 x = 0 x = 15 x = 14 x = 13 x = 12 x = 11 x = 10 x = 9 x = 8 x = 7 x = 6 x = 5 x = 4 x = 3 x = 2 x = 1 cw ccw x x ib (%)
tb62209f g 201 4 - 10- 0 1 48 application circuit (example) the values for the devices are all recommended values. for values under each input condition, see the above - mentioned recommended operating conditions. note: adding bypass capacitors is recommended . make sure that gnd wiring has only one contact point, and to design the pattern that allows the heat radiation. to control setting pins in each mode by sw, make sure to pull down or pull up them to avoid high impedance. to input the data , see the section on the recommended input data. please use data mod e fixed at the l level. m r osc = 3.6 k c osc = 560 pf v ref ab v m r rs a a b a b r rs b v ss (f in ) protect mo dmode 3 dmode 2 dmode 1 mdt 1 mdt 2 standby p - gnd reset cw/ccw enable clk data mode v dd cr v ref ab 3 v 1 f sgnd r rs a 0.66 stepping motor 0.66 r rs b sgnd sgnd sgnd 5 v 10 f ccp c ccp b ccp a ccp 2 0.022 f ccp 1 0.22 f data mode torque 2 torque 1 open open 0 v 0 v 5 v 0 v 24 v sgnd 100 f 5 v 0 v 5 v 0 v 5 v 5 v 0 v 5 v 0 v 5 v 0 v 5 v 0 v 5 v 0 v 5 v 0 v 5 v 0 v 5 v 0 v 5 v 0 v 5 v pgnd careful attent ion should be paid to the layout of the output, vdd(vm) and gnd traces, to avoid short circuits across output pins or to the power supply or ground. if such a short circuit occurs, the device may be permanently damaged.
tb62209f g 201 4 - 10- 0 1 49 package dimensions weight: 0.79 g (typ.)
tb62209f g 201 4 - 10- 0 1 50 notes on contents 1. block diagrams some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or so me parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application examples the application examples provided in this data sheet are provided for reference only. thorough ev aluation and testing should be implemented when designing your application's mass production design. in providing these application examples, toshiba does not grant the use of any industrial property rights. 5. test circuits components in the test circuit s are used only to obtain and confirm the device characteristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics [1 ] the abs olute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause breakdown, damage or deterioration of the device, which may result in i njury by explosion or combustion. [ 2 ] do not insert devices incorrectly or in the wrong orientation. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the a bsolute maximum rating, and exceeding the rating(s) may cause breakdown, damage or deterioration of the device, which may result in injury by explosion or combustion. in addition, do not use any device that has had current applied to it while inserted inco rrectly or in the wrong orientation even once. [ 3 ] use an appropriate power supply fuse to ensure that a large current does not continuously flow in the event of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow. such a breakdown can lead to smoke or ignition. to minimize the effects of a large current flow in the event of breakdown, fuse capacity, fusing time, insertion circuit location, and other such suitable settings are required. [4] if your design includes an inductive load such as a motor coil, incorporate a protection circu it into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back el ectromotive force at power off. ic breakdown may cause injury, smoke or igni tion. for ics with built - in protection functions, use a stable power supply with. an unstable power supply may cause the protection function to not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition .
tb62209f g 201 4 - 10- 0 1 51 [ 5 ] carefully select po wer amp, regulator, or other external components (such as inputs and negative feedback capacitors) and load components (such as speakers). if there is a large amount of leakage current such as input or negative feedback capacitors, the ic output dc voltage will increase. if this output voltage is connected to a speaker with low input withstand voltage, overcurrent or ic failure can cause smoke or ignition. (the over current can cause smoke or ignition from the ic itself.) in particular, please pay attention when using a bridge tied load (btl) connection type ic that inputs output dc voltage to a speaker directly. points to remember on handling of ics (1) over current protection circuit over current protection circuits (referred to as current limiter circ uits) do not necessarily protect ics under all circumstances. if the over current protection circuits operate against the over current, clear the over current status immediately. depending on the method of use and usage conditions, such as exceeding absol ute maximum ratings can cause the over current protection circuit to not operate properly or ic breakdown before operation. in addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the ic may generate heat resulting in breakdown. (2) thermal shutdown circuit thermal shutdown circuits do not necessarily protect ics under all circumstances. if the thermal shutdown circuits operate against the over temperature, clear the heat generat ion status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or ic breakdown before operation. (3) heat dissipation design in using a n ic with large current flow such as a power amp, regulator or driver, please design the device so that heat is appropriately dissipated, not to exceed the specified junction temperature (t j ) at any time or under any condition. these ics generate heat even during normal use. an inadequate ic heat dissipation design can lead to decrease in ic life, deterioration of ic characteristics or ic breakdown. in addition, please design the device taking into consideration the effect of ic heat dissipation on peripher al components. (4) back - emf when a motor rotates in the reverse direction, stops or slows down abruptly , a current flow back to the motor s power supply due to the effect of back - emf. if the current sink capability of the power supply is small, the device s motor power supply and output pins might be exposed to conditions beyond maximum ratings. to avoid this problem, take the effect of back - emf into consideration in your system design.
tb62209f g 201 4 - 10- 0 1 52 restrictions on product use ? toshiba corporation, and its subsidiarie s and affiliates (collectively "toshiba"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be repr oduced without prior written permission from toshiba. even with toshiba's written permission, reproduction is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, softwar e and systems which minimize risk and avoid situations in which a malfunction or fai lure of product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. before customers use the product, create designs including t he product, or incorporate the product into their own applications, customer s must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set fort h in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be used with or for. customers are solely responsible for all as pects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, samp le application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warrant ed for use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " uninten ded use " ). except for specific applications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles , trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance - related fields. if you us e product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse - engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited unde r any applicable laws or regulations. ? the information contained herein is presented only as guidance for product use. no respons ibility is assumed by toshiba for any infringement of patents or any other intellectual property rights of third parties that may result from the use of product. n o license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provided in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, consequential, special, or incidental damages or loss, including without limitation, loss of profits, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and condi tions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related softwar e or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or mis sile technology products (mass destruction weapons). product and relat ed software and technology may be controlled under the applicable export laws and regulations including, without limitation, the japanese foreign exchange and foreign trade law and the u.s. export administration regulations. export and re - export of product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pr oduct. please use product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled su bstances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losse s occurring as a result of nonco mpliance with applic able laws and regula tions.

▲Up To Search▲

Price & Availability of TB62209FG-14

	To Download TB62209FG-14 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .